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VLSI Design Technology Question & Answers

June 21, 2021 By WatElectronics

This article lists 100+ VLSI Design Technology MCQs for engineering students. All the VLSI Design Technology Questions & Answers given below include a hint and wherever possible link to the relevant topic. This is helpful for the users who are preparing for their exams, interviews, or professionals who would like to brush up their fundamentals on the VLSI Design Technology topic.

The components like Resistors, Capacitors, Diodes, and Transistors are manufactured separately & these are joined through wires or on a Printed Circuit Board (PCB) to form different circuits which are known as Discrete circuits.

For the design of large circuits, more space is needed to accommodate multiple required components, as well as the circuit's reliability, gets affected. To overcome this issue, a circuit with various components are interconnected on a single chip has been developed that is known as an Integrated circuit.

Further, the placement of the number of active devices leads to various generations in the IC technology. VLSI is a part of Integrated circuits that paved the way for various applications in the electronic industries like Image and video processing, telecommunications, consumer electronics.

1). VLSI is an acronym for _________________.

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2). Integration circuits possess ______ basic generations.

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3). Integrated circuit created by VLSI due to the combination of __________ transistors.

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4). MOSFETs possess __________.

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5). The circuits integrated are _______ in size.

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6). Integrated chip with lesser than 10 transistors is known as _________.

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7). How many gates are present on each chip for Medium scale integration?

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8). The number of transistors present in LSI are __________.

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9). The classification of ICs is also based on _______.

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10). Which circuits work on low voltages?

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11). More amount of power can be handled by _________ circuits.

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12). Isolation among the devices is a must in ___________ circuits.

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13). The adjoining transistors in an integrated circuit can be isolated using ___________ technique.

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14). The initial step involved in the IC fabrication is ___________.

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15). Wafers properties depends upon the ____________ of crystalline structures.

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16). The process in which the impurities added to the pure form of silicon is known as ____________.

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17). Heavily doped silicon has _________ resistivity.

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18). Silicon doped with Boron to obtain _________ substrate.

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19). The resistivity of the crystal is controlled by the value of _______ added.

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20). The thickness and the size of the crystal is _________ proportional to each other.

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21) .What is the second step in the IC fabrication?

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22). In silicon the ability of controlling the various impurities and the concentration of doping leads to the formation of _____________________.

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23). What are the types of oxidation?

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24). Deposition of gate oxide prefers _______.

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25). Masking oxide preparation prefers ___________.

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VLSI Design Technology MCQs for Interview

26). The silicon wafer when reacted with oxygen is converted to _________.

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27). Oxidation in silicon can be occurred by raising ______

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28). Sio2 is excellent at ____.

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29). The selective removal of oxide from the crystal is known as ___________.

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30). Photolithography is all about _____________.

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31). For a p-type substrate the diffusion is performed with ___________.

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32). What is next step after Photolithography?

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33). The diffusion of n+ layer can occur by using _________ dopant.

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34). Growing another layer of crystal on above the top of substrate is known as _______________.

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35). The n layer formed due to epitaxy acts as __________ of an npn transistor.

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36). Buried layer diffusion of n+ is performed to reduce _______.

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37). After all the terminals of the transistor and the ohmic contacts are formed the contact to the outer world is established by ________.

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38). The metal preferred in VLSI for contacting is _________.

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39). In the advent of the latest technology the contact metal aluminum is replaced with _______.

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40). Doping can also be done by using ________.

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41). Field oxide is the first step of fabrication in ___________.

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42). The thickness of field oxide in the MOSFET is _________.

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43). _________ takes active participation performance wise.

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44). What is the most critical step in the fabrication of MOSFETs?

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45). MOSFET is a __________ device.

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46). Types of transistors provided by CMOS technology are ____________.

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47). Different terminals of the MOS transistors are __________.

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48).Different types of MOS layers are _______.

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49). What are the various modes in the MOSFETs?

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50). Enhancement mode MOSFETs are initially _________.

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VLSI Design Technology Question & Answers

51). ___________ MOSFETs are always ON initially.

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52). Power is wasted in ________ MOSFETs.

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53). For Digital applications ________ is used. 53). For Digital applications ________ is used.

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54). Depletion mode n MOSFETs have __________ threshold voltage.

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55). The threshold voltage of the MOSFET depends upon ________.

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56). What are the various types of process in CMOS?

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57). The combination of CMOS and the bipolar technologies is ____________.

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58).The various advantages of CMOS process are ____________.

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59). Transistors with lesser length of channel i.e., in between 3 to 5 microns are known as _______.

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60). A device in a circuit connected to drag the value of the voltage at output to the lowest supply of voltage is known as ____________.

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61).Pull up devices can drag the voltage at output to __________.

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62). Which technology is preferred than PMOS?

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63). What are the different regions in which MOS transistors operate?

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64). ____________ is acts as a interface in between the actual layout and the symbolic circuit.

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65). Green colour in the stick diagram represents ___________.

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66). Red colour in the stick diagram represents __________.

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67). Buried contact is represented by _____________ colour.

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68). Contact areas in the stick diagram are represented by ________ colour.

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69). Increase in the VDS cause growth of ___________at the junction of drain.

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70). Substrate-bias effect is also known as __________.

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71). Threshold voltage in the MOS transistor is applied in between ________ and ______ terminals.

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72). Time taken by the waveform to rise initially from ‘10 % to 90%’ of the steady-states value is known as __________.

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73).Time taken by the waveform to fall from ‘90% to 10%’ of the steady-states value is known as _________.

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74).Time taken to pass a logical transition from the input stage to the output is known as ____

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75).What are the types involved in power dissipation?

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VLSI Design Technology Important Questions with Answers

76). Leakage current results in __________ dissipation.

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77). Dynamic dissipation occurs due to ______.

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78). CAD in VLSI stands for _______.

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79). BOOM is a ________.

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80). Which is the software used in VLSI?

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81). ____________ is used in the modeling of digital systems i.e., from algorithmic to switching.

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82). How many types of modeling are present in Verilog?

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83). What are the various modeling in Verilog?

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84). ___________ modeling describes the usage of logic gates and specifies the way they are wired or connected.

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85). _______________ modeling controls the simulations and manipulates the variables of data types.

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86). In Verilog X represents ___________ condition in the hardware circuits.

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87). High impedance and the floating state in Verilog is represented by ______.

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88). False condition in hardware is represented by ________.

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89). Level 1 represents ___________ in the hardware circuits.

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90). In which phase the micro design of the hardware gets modeled into HDL?

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91). The information about the timing of gates is present in ___________-.

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92). RTL coding in the VLSI design flow comes under ________ process.

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93). Placement and Routing in VLSI comes under ____________ VLSI design.

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94). ASIC stands for _________.

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95). The prefabricated chip of silicon with the most number of transistors has no functions predetermined are known as __________.

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96). How many types of gate arrays are present in ASIC?

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97). What are the methods of timing control?

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98). Verilog supporting the basic form of logic gates are known as ___________.

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99). What are the blocks present in Behavioral modeling?

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100). Which block gets executed in a particular loop and during simulation gets repeated?

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101). What are the various types of ASIC?

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102). FPGA classified under _________ ASIC.

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103). Predesigned cells of logic used in a cell based ASIC are known as _____________

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104). EEPROM stands for _________.

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105). Logic cells present in the library of gate arrays are known as _________.

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106). PALs consist of devices that are programmed by altering the switching elements characteristics are known as _______.

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107). _____________ tests are used in design cycle as early as possible to verify the circuit functionality.

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108). ________ tests verify each register and gate functioning properly or not.

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109). Examples of Fault models __________.

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110). The input of a faulty gate modeled to get stuck at zero or stuck at one is possible in ______________.

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