Integrated Circuits Question & AnswersOctober 4, 2021 By WatElectronics This article lists 100+ Integrated Circuits MCQs for engineering students. All the Integrated Circuits Questions & Answers given below include a hint and a link wherever possible to the relevant topic. This is helpful for users who are preparing for their exams, interviews, or professionals who would like to brush up on their fundamentals on IC technology.An integrated circuit (IC) is a small chip made with a semiconductor material like Si. As compared to the normal electronic circuits, which are built with various electronic components, the monolithic IC is the most commonly used chip. The different types of integrated circuits available in the market are; analog, digital, linear, RF, mixed, logic circuits, comparators, voltage regulators, op-amps, timer ICs, etc. The advantages of ICs mainly include; less cost, small size, reliability, less weight, etc.The disadvantages of ICs are; In an integrated circuit, different components are fabricated but if any component fails in IC, then the whole integrated circuit has to be changed with a new one. The dissipation of power is restricted to 10 watts. The applications of Integrated circuits mainly include; radar, watches, TVs, computers, memory devices, Wristwatches, Juice makers, TVs, logic devices, memory devices, Video processors, etc. 1). An IC contains--------------.? Passive elements Active elements Both Passive and active elements None of the above HintIC includes both the components2). The most complicated component fabricated on IC is -------? Diode Resistor Transistor Conductor. HintIt is used to amplify the signals3). The bottom layer of an IC serves as? Connector layer Insulating layer Substrate None of the above HintThe chemical species within chemical reaction4). All the active and passive elements are grown on the------layer of the IC? First substrate layer The second layer which is a single crystal extension of the substrate The SiO2 layer The Polysilicon layer HintA single crystal extension of the substrate5). The substrate is typically of size-----? 25 mils thick 16 mils thick 2 mils thick 6 mils thick. Hint>3<7 mils thick.6). The second layer of IC is of ---------- mils thickness? 2 3 1 1.5 HintIt is unity7). The diffusion of impurities is done on the-----layer? Substrate layer Second layer SiO2 layer All of the above HintSecondary Layer8). IC fabrication depends upon---? Materials Processes Design Principles All of the above HintIt depends on different properties9).------ protects the wafer from contamination due to impurities? SiO2 layer Masks Photoresist layer Diffusion HintIt is also known as silica10). Selective etching is done using------? Diffusion process Photolithography process Metallization process Masking process HintIt is also known as optical lithography11). Usually, the substrate of IC is made up of------ Germanium metal Silicon SiO2 Aluminium. HintThe substrate is made up of p-type silicon melt with a predetermined number of impurities. 12). The cross-section of an IC is usually----? 50 by 50 mils 6 by 6 mils 25 by 25 mils 16 by 16 mils HintIt is 50/50 mils13). The process of forming an IC on a single silicon chip is known as----- Single process IC Monolithic IC Epitaxial IC All of the above HintIt is a group of circuits14). In epitaxial growth, the resistivity of the n-type epitaxial layer is ------? Independent of the substrate Dependent on the substrate Equal to that of the substrate Zero HintThis phenomenon takes on a life of its own15). A thin layer of SiO2 is formed over the epitaxial layer by exposing the wafer to an oxygen atmosphere at a temperature of ---? 1500 Degrees C 2500 Degrees C 5000 Degrees C 1000 Degrees C HintThe termperature is 1K degrees centigrade16). Silicon dioxide helps the penetration of impurities. True False Partially All of the above. HintSilicon dioxide layer prevents the penetration of impurities hence helping in selective diffusion after etching.17). After epitaxial growth the next step for IC fabrication is..? Base diffusion Emitter diffusion Metallization Isolation diffusion HintIn isolation diffusion, p-type impurities penetrate the n-type epitaxial layer and reaches p-type substrate forming electrical isolation between circuit components (Isolation regions).18). The collectors of different transistors are drawn from---? Different isolation regions Same isolation regions Epitaxial region Photoresist region HintUsing different isolation regions19). To make p-n junctions reverse biased, with respect to isolation region the p-type substrate must also be held at---? Zero Unity Positive potential Negative potential HintNegative terminal20). While operating circuit, the isolation will be lost if the p-n junction is----- Reverse biased Forward biased Short-circuited Open circuited HintIt happens once the voltage across a diode allows the natural current flow21), To prevent the connection between two isolation islands, the concentration of acceptor ions between isolation regions should be... ? Zero Lower than that of the substrate Higher than that of the substrate Equal to that of the substrate. HintAs compared to substrate it is higher22). Using base diffusion step------ are formed on IC? Transistor base regions Resistors Anodes of the diode All of the above HintResistors, anodes of the diode, etc are formed23). In base diffusion step ---------impurities are diffused? p-type n-type Both p & n-type None of the above. HintIn this type, majority charge carriers are holes24). The resistivity of the base layer is------- the isolation region? Equal to Lower than Higher than Reciprocal HintIt is maximum as compared to isolation region25). In emitter diffusion step-------- are formed? Transistor emitters Resistors Junction capacitors Only a & c HintIn emitter diffusion step n-type diffusion takes place.Integrated Circuits MCQs for Interviews26). Aluminium is a------------ type impurity in a silicon N-type P-type Inert Metallic HintThe majority charge carriers in this are holes27). ------------ prevents the formation of the p-n junction when aluminium is used for ohmic contact? A large concentration of phosphorus A large concentration of Silicon A large concentration of Polysilicon None of these HintLarge concentration of n-type phosphorus is diffusion at the areas of ohmic contact during the emitter diffusion process.28). The interconnections are made during ------- Emitter diffusion process Photolithography process Epitaxial growth Metallization process HintThroughout metalization method29). For interconnection, Aluminum is deposited on the wafer through------? Diffusion Oxidation Vacuum deposition All of these. HintUsing vacuum deposition a thin coating of aluminium is done over the entire surface of the wafer.30). The-----------technique is used to etch away all the undesired aluminium areas? Photoresist Oxidation Diffusion Polishing HintIt is simply known as a resist31). The wafer is separated into individual chips after the-----------process? Etching process Isolation process Metallization process Diffusion process HintA large number of identical circuits are simultaneously manufactured on a wafer. So after interconnection, these circuits are separated using a diamond-tipped tool.32). After attaching the chip to a suitable header, the package leads are connected to IC using -------? Aluminium wire. Copper wire Lead wire All of these. HintWith the help of an Al wire33). During the photolithographic process the wafer is coated with----? SiO2 Polysilicon Photosensitive emulsion Mask HintIt is a photographic emulsion 34). After placing the mask over the photoresist the wafer is subjected to---? UV rays Visible light Infrared rays All of these. HintThese are ultraviolet rays35). The unexposed portions of the photoresist layer are removed using------? Ethylene Water CO2 Trichloroethylene HintThe chemical element is TCE36). The integrated circuit is available in ------ size? Large Small Medium Nano HintICs are available in small size.37). Which of the following material is used to made IC? Germanium Silicon Boron Nitride Copper HintIt is an IV group element which is also called as Si38). Which of the following IC package is most popular? TO-5 DIP Flat Pack Through Hole HintIt is the standardized US military PCB based surface-mount-component package39). The most commonly used ICs are? Hybrid Monolithic Thickfilm Thinfilm HintIt is a complete circuit, manufactured in a single crystal40). Which of the following components are not fabricated on IC? Transistors Resistors Diodes Transformers HintIt is used to step up/down the voltage in electrical circuits. Please refer to this link for Electrical & Electronic Components 41). An active components used in an IC are? Diodes Resistors Capacitors Diodes HintIt acts like a one way switch42). ICs used in computers are? Analog Digital Linear None of the above HintThese ICs handles discrete signals43). Which ICs are used in computers? Analog Digital Linear None of the above HintThese ICs handles discrete signals44). Which of the following passive component is more difficult to fabricate on integrated circuit? FET Diode Capacitor Transistor HintIt is used to store the energy.45). Which of the following IC is used for special purpose? LM380 LM741 LM351 LM714 HintThis IC is used in the audio power application only.46). In a typical IC package, how many op-amps are used? 2 4 6 8 Hint4 quad op-amps, single-2 and dual-2 op-amps47). Which of the following circuits are not made with digital ICs? Multiplexers Demultiplexers Counters Shift Registers HintThe short form of these circuits is MUX48). The full form of the SSI is? Small scale industries Small scale integration Surface scale integration Small surface integration HintThe services are finished on a micro/small scale49). When the components size is increased within the IC, then the IC size will be…? Decreased Increased No change IC will damage HintThe size of integrated circuit will be increased.50). Microelectronics are used to reduce the size of components upto….? 3 times 2 times 10 times 5 times HintThe size will be reduced maximum.Integrated Circuits MCQs for Exams 51). Which of the following IC is an example of linear IC.? Audio amplifier Differential amplifier Instrumentation amplifier Operational amplifier HintIt is used in audio based applications52). Which of the following layer works like an insulating layer? SiO2 TiO2 Graphene Oxide Metal Oxide HintIt is also recognized in the form of quartz53). Integrated circuits are used in? Linear & Digital devices Linear devices Digital devices None HintThese devices are resistors, capacitors, computers, mobiles, etc54). Which of the following ICs are used by op-amps? Linear Digital Linear & Digital None HintIn analog and digital integrated circuits.55). Which of the following IC is different to 741C version? 741S 7412C 741SC 721AS HintThis IC includes SC series56). The 1st generation integrated circuit includes…? Latch up issue Includes number of transistors Protection of short circuit Sensitive to temperature HintFirst generation IC is made with some protection from s/c57). Transient response is also known as? Steady state Time varying Linear Non Linear HintIt changes with time58). The main drawback of integrated circuit is? It uses more power Parameter within the IC cannot be changed It uses less external connections Large size HintIC parameters are fixed59). The op-amps internal circuit is? Clipper Clamper Differential Amplifier Diode HintThese are also known DC voltage restorers.60). The tool used to observe the connection between an integrated circuit? Microphone Telescope Microscope Lenses HintIt generates enlarged images of tiny objects61).Which of the below components are available in monolithic IC? Active & Passive components Linear components Non-linear components None of the above HintThese components use some property for controlling the electrical signal.62).The performance of monolithic IC is? Depends on the connections On Packaging On Substrate Doesn’t depend on the substrate HintIt depends on rock, fungi, etc63).Oxidation is mainly used for? Doping Isolation Interconnection Remove connections HintIt is used to prevent DC and AC in a system64). Metallization is mainly used for? Packaging Interconnection Protection Security HintIt is a mutual connection between two parts65).Packaging in IC is used for? Interconnection Safety Provide supply Cleaning HintIt is used for protection purpose66).What is the function of testing? For quality control To check the functionality of components To provide supply Check the errors HintIt is used to check the quality of product whether that is improved or not.67).What is the purpose of optical masking? For safety For cleaning For pattern transfer None HintUsed for transferring pattern68).Etching is used to …? Remove surface Give protection Protect from short circuit Provide package HintThe shell of an IC can be removed69). The system on chip or SoC includes… ? Analog ICs Linear ICs Analog & Digital ICs Non-linear ICs HintIn includes both the integrated circuits70). In which of the following circuits components are soldered… ? Linear Discrete Analog Monolithic HintThese components are connected on PCB through connecting wires71). The logic gates used in large scale ICs are…? < 12 >12<100 >100<1000 >1000 HintHighest number of logic gates are used72). It is not achievable to generate integrated circuits of power rating above …? 1 Watt 5 Watts 10 Watts 1000 Watts HintBelow 100 watts73). In which of the following layer monolithic IC is fabricated…? Si Ge Ta Cu HintThe atomic number of this element is 7374). The interconnection of IC components can be done through an aluminum conductor is known as? Sputtering process Metalization process Switching process Etching process HintThis kind of process generates thin-film metal layer75). Which of the below circuits are also known as digital circuits? Timer Circuits Switching Circuits Coders Timers HintSwitching circuits performs arithmetic/ logic operations.76). In which of the following ICs fabrication, monolithic method is used? Analog Digital Linear Non-linear HintThese are also known as combinational logic ICs77). Which of the below components are used like an individual components in thick film and thin film ICs from outside? Transistor Resistor Diode Capacitor HintTransistor is used to switch or amplify electronic signals 78). The chip is also called as? Device Substrate Interpose Die HintIt is a semiconducting material block79).The size of any normal integrated circuit is? 0.2mm X 0.2mm X 0.001mm 0.1mm X 0.2mm X 0.01mm 0.01mm X 0.1mm X 0.2mm 0.2mm X 0.001mm X 0. 1mm HintIts length and widths are 0.2mm X 0.2mm80).The SSI chip includes….components? <12 >20 <5 >100 HintIt ranges from >10 to <1581). As compared to an inductor, transistor occupies…space? More Less Similar Cannot be fitted HintThe space occupied by an inductor is more82).The analog inputs and channel multiplexers present in an ADC 0809 IC are? 2 8 10 12 HintIt ranges from >5 and <1083). How the quantization error can be reduced in an ADC? By enhancing the bits Reducing the bits Maintaining the bits stable None of the above HintBy increasing the bits84).For an ideal operational amplifier, the PSRR value is? 1 0 Infinite -1 HintThe PSRR values is null85).Which of the following is an op-amp parameter ? PSSR PSWR PSVR PSVS HintIt is used to reject ripple at the input86). Differential amplifier’s CMRR can be enhanced through decreasing…? Common mode voltage gain Temperature Differential voltage gain S/N ratio HintWhen both inputs of this amplifier is same then it is low87).The series pass transistor in a linear voltage regulator operates in…….? Saturation region Active region Cut-off None HintThis region lies in between cut off & saturation88). In DAC, when the number of bits increases then the resolution will be….? Decreased Increased Constant None of the above HintIt is directly proportional89). What is the response time value of an ideal comparator….? 1 0 Infinite -1 HintThe value is null90). Which of the following sensor is used in a temperature controller circuit with an instrumentation amplifier..? Thermistor LDR Water level Force sensor HintIt is a resistance thermometer91). Which of the following is the op-amps non-linear application..? Precision rectifier Comparator VI converter Instrumentation amplifier HintIt is one kind of rectifier92). The noise occurred in operational amplifiers because of discrete current flow within the device is ….? Burst Flicker Thermal Shot HintIt is also called poisson noise93). In bipolar operational amplifier, the stages involved….? 1 2 3 4 HintThe stages are triple94). In digital integrated circuits, the power dissipation is expressed through….? Nanowatts DB Watts/Kilo Watts MdB HintThe power dissipation in DIC is expressed in milli or nano watts95). The IC package used for experimental purpose is….? Flat pack DIP Meta Transistor pack HintThis package is easy to mount96). Metal oxide semiconductor is being used in….? SSI MSI VLSI ULSI HintIt is also known as very large scale integration technology97). What is the use of notch & dot within DIP integrated circuits….? Discover the pin number Determine the Pinout IC property Type of device HintUsed to represent the pin number in IC98). In IC components, why MOSFET is preferred over BJT? It has less packing density It has medium packing density It response easily Easily fitted HintThe number of MOSFET cells is fitted in a specific area99). In hybrid microwave ICs, the mask is made with…? Si Quartz Rubylith Arsenic HintIt is used in several areas of graphic design.100). Analog Integrated Circuits are available in…..types? 2 4 6 8 HintThey are linear ICs & RF ICs Please refer to this link to know more about Integrated Circuit Time is Up! Time's up
