Integrated Circuits Question & Answers October 4, 2021 By WatElectronics This article lists 100+ Integrated Circuits MCQs for engineering students. All the Integrated Circuits Questions & Answers given below include a hint and a link wherever possible to the relevant topic. This is helpful for users who are preparing for their exams, interviews, or professionals who would like to brush up on their fundamentals on IC technology. An integrated circuit (IC) is a small chip made with a semiconductor material like Si. As compared to the normal electronic circuits, which are built with various electronic components, the monolithic IC is the most commonly used chip. The different types of integrated circuits available in the market are; analog, digital, linear, RF, mixed, logic circuits, comparators, voltage regulators, op-amps, timer ICs, etc. The advantages of ICs mainly include; less cost, small size, reliability, less weight, etc. The disadvantages of ICs are; In an integrated circuit, different components are fabricated but if any component fails in IC, then the whole integrated circuit has to be changed with a new one. The dissipation of power is restricted to 10 watts. The applications of Integrated circuits mainly include; radar, watches, TVs, computers, memory devices, Wristwatches, Juice makers, TVs, logic devices, memory devices, Video processors, etc. 1). An IC contains--------------.? Passive elements Active elements Both Passive and active elements None of the above Hint 2). The most complicated component fabricated on IC is -------? Diode Resistor Transistor Conductor. Hint 3). The bottom layer of an IC serves as? Connector layer Insulating layer Substrate None of the above Hint 4). All the active and passive elements are grown on the------layer of the IC? First substrate layer The second layer which is a single crystal extension of the substrate The SiO2 layer The Polysilicon layer Hint 5). The substrate is typically of size-----? 25 mils thick 16 mils thick 2 mils thick 6 mils thick. Hint 6). The second layer of IC is of ---------- mils thickness? 2 3 1 1.5 Hint 7). The diffusion of impurities is done on the-----layer? Substrate layer Second layer SiO2 layer All of the above Hint 8). IC fabrication depends upon---? Materials Processes Design Principles All of the above Hint 9).------ protects the wafer from contamination due to impurities? SiO2 layer Masks Photoresist layer Diffusion Hint 10). Selective etching is done using------? Diffusion process Photolithography process Metallization process Masking process Hint 11). Usually, the substrate of IC is made up of------ Germanium metal Silicon SiO2 Aluminium. Hint 12). The cross-section of an IC is usually----? 50 by 50 mils 6 by 6 mils 25 by 25 mils 16 by 16 mils Hint 13). The process of forming an IC on a single silicon chip is known as----- Single process IC Monolithic IC Epitaxial IC All of the above Hint 14). In epitaxial growth, the resistivity of the n-type epitaxial layer is ------? Independent of the substrate Dependent on the substrate Equal to that of the substrate Zero Hint 15). A thin layer of SiO2 is formed over the epitaxial layer by exposing the wafer to an oxygen atmosphere at a temperature of ---? 1500 Degrees C 2500 Degrees C 5000 Degrees C 1000 Degrees C Hint 16). Silicon dioxide helps the penetration of impurities. True False Partially All of the above. Hint 17). After epitaxial growth the next step for IC fabrication is..? Base diffusion Emitter diffusion Metallization Isolation diffusion Hint 18). The collectors of different transistors are drawn from---? Different isolation regions Same isolation regions Epitaxial region Photoresist region Hint 19). To make p-n junctions reverse biased, with respect to isolation region the p-type substrate must also be held at---? Zero Unity Positive potential Negative potential Hint 20). While operating circuit, the isolation will be lost if the p-n junction is----- Reverse biased Forward biased Short-circuited Open circuited Hint 21), To prevent the connection between two isolation islands, the concentration of acceptor ions between isolation regions should be... ? Zero Lower than that of the substrate Higher than that of the substrate Equal to that of the substrate. Hint 22). Using base diffusion step------ are formed on IC? Transistor base regions Resistors Anodes of the diode All of the above Hint 23). In base diffusion step ---------impurities are diffused? p-type n-type Both p & n-type None of the above. Hint 24). The resistivity of the base layer is------- the isolation region? Equal to Lower than Higher than Reciprocal Hint 25). In emitter diffusion step-------- are formed? Transistor emitters Resistors Junction capacitors Only a & c Hint Integrated Circuits MCQs for Interviews 26). Aluminium is a------------ type impurity in a silicon N-type P-type Inert Metallic Hint 27). ------------ prevents the formation of the p-n junction when aluminium is used for ohmic contact? A large concentration of phosphorus A large concentration of Silicon A large concentration of Polysilicon None of these Hint 28). The interconnections are made during ------- Emitter diffusion process Photolithography process Epitaxial growth Metallization process Hint 29). For interconnection, Aluminum is deposited on the wafer through------? Diffusion Oxidation Vacuum deposition All of these. Hint 30). The-----------technique is used to etch away all the undesired aluminium areas? Photoresist Oxidation Diffusion Polishing Hint 31). The wafer is separated into individual chips after the-----------process? Etching process Isolation process Metallization process Diffusion process Hint 32). After attaching the chip to a suitable header, the package leads are connected to IC using -------? Aluminium wire. Copper wire Lead wire All of these. Hint 33). During the photolithographic process the wafer is coated with----? SiO2 Polysilicon Photosensitive emulsion Mask Hint 34). After placing the mask over the photoresist the wafer is subjected to---? UV rays Visible light Infrared rays All of these. Hint 35). The unexposed portions of the photoresist layer are removed using------? Ethylene Water CO2 Trichloroethylene Hint 36). The integrated circuit is available in ------ size? Large Small Medium Nano Hint 37). Which of the following material is used to made IC? Germanium Silicon Boron Nitride Copper Hint 38). Which of the following IC package is most popular? TO-5 DIP Flat Pack Through Hole Hint 39). The most commonly used ICs are? Hybrid Monolithic Thickfilm Thinfilm Hint 40). Which of the following components are not fabricated on IC? Transistors Resistors Diodes Transformers Hint Please refer to this link for Electrical & Electronic Components 41). An active components used in an IC are? Diodes Resistors Capacitors Diodes Hint 42). ICs used in computers are? Analog Digital Linear None of the above Hint 43). Which ICs are used in computers? Analog Digital Linear None of the above Hint 44). Which of the following passive component is more difficult to fabricate on integrated circuit? FET Diode Capacitor Transistor Hint 45). Which of the following IC is used for special purpose? LM380 LM741 LM351 LM714 Hint 46). In a typical IC package, how many op-amps are used? 2 4 6 8 Hint 47). Which of the following circuits are not made with digital ICs? Multiplexers Demultiplexers Counters Shift Registers Hint 48). The full form of the SSI is? Small scale industries Small scale integration Surface scale integration Small surface integration Hint 49). When the components size is increased within the IC, then the IC size will be…? Decreased Increased No change IC will damage Hint 50). Microelectronics are used to reduce the size of components upto….? 3 times 2 times 10 times 5 times Hint Integrated Circuits MCQs for Exams 51). Which of the following IC is an example of linear IC.? Audio amplifier Differential amplifier Instrumentation amplifier Operational amplifier Hint 52). Which of the following layer works like an insulating layer? SiO2 TiO2 Graphene Oxide Metal Oxide Hint 53). Integrated circuits are used in? Linear & Digital devices Linear devices Digital devices None Hint 54). Which of the following ICs are used by op-amps? Linear Digital Linear & Digital None Hint 55). Which of the following IC is different to 741C version? 741S 7412C 741SC 721AS Hint 56). The 1st generation integrated circuit includes…? Latch up issue Includes number of transistors Protection of short circuit Sensitive to temperature Hint 57). Transient response is also known as? Steady state Time varying Linear Non Linear Hint 58). The main drawback of integrated circuit is? It uses more power Parameter within the IC cannot be changed It uses less external connections Large size Hint 59). The op-amps internal circuit is? Clipper Clamper Differential Amplifier Diode Hint 60). The tool used to observe the connection between an integrated circuit? Microphone Telescope Microscope Lenses Hint 61).Which of the below components are available in monolithic IC? Active & Passive components Linear components Non-linear components None of the above Hint 62).The performance of monolithic IC is? Depends on the connections On Packaging On Substrate Doesn’t depend on the substrate Hint 63).Oxidation is mainly used for? Doping Isolation Interconnection Remove connections Hint 64). Metallization is mainly used for? Packaging Interconnection Protection Security Hint 65).Packaging in IC is used for? Interconnection Safety Provide supply Cleaning Hint 66).What is the function of testing? For quality control To check the functionality of components To provide supply Check the errors Hint 67).What is the purpose of optical masking? For safety For cleaning For pattern transfer None Hint 68).Etching is used to …? Remove surface Give protection Protect from short circuit Provide package Hint 69). The system on chip or SoC includes… ? Analog ICs Linear ICs Analog & Digital ICs Non-linear ICs Hint 70). In which of the following circuits components are soldered… ? Linear Discrete Analog Monolithic Hint 71). The logic gates used in large scale ICs are…? < 12 >12<100 >100<1000 >1000 Hint 72). It is not achievable to generate integrated circuits of power rating above …? 1 Watt 5 Watts 10 Watts 1000 Watts Hint 73). In which of the following layer monolithic IC is fabricated…? Si Ge Ta Cu Hint 74). The interconnection of IC components can be done through an aluminum conductor is known as? Sputtering process Metalization process Switching process Etching process Hint 75). Which of the below circuits are also known as digital circuits? Timer Circuits Switching Circuits Coders Timers Hint 76). In which of the following ICs fabrication, monolithic method is used? Analog Digital Linear Non-linear Hint 77). Which of the below components are used like an individual components in thick film and thin film ICs from outside? Transistor Resistor Diode Capacitor Hint 78). The chip is also called as? Device Substrate Interpose Die Hint 79).The size of any normal integrated circuit is? 0.2mm X 0.2mm X 0.001mm 0.1mm X 0.2mm X 0.01mm 0.01mm X 0.1mm X 0.2mm 0.2mm X 0.001mm X 0. 1mm Hint 80).The SSI chip includes….components? <12 >20 <5 >100 Hint 81). As compared to an inductor, transistor occupies…space? More Less Similar Cannot be fitted Hint 82).The analog inputs and channel multiplexers present in an ADC 0809 IC are? 2 8 10 12 Hint 83). How the quantization error can be reduced in an ADC? By enhancing the bits Reducing the bits Maintaining the bits stable None of the above Hint 84).For an ideal operational amplifier, the PSRR value is? 1 0 Infinite -1 Hint 85).Which of the following is an op-amp parameter ? PSSR PSWR PSVR PSVS Hint 86). Differential amplifier’s CMRR can be enhanced through decreasing…? Common mode voltage gain Temperature Differential voltage gain S/N ratio Hint 87).The series pass transistor in a linear voltage regulator operates in…….? Saturation region Active region Cut-off None Hint 88). In DAC, when the number of bits increases then the resolution will be….? Decreased Increased Constant None of the above Hint 89). What is the response time value of an ideal comparator….? 1 0 Infinite -1 Hint 90). Which of the following sensor is used in a temperature controller circuit with an instrumentation amplifier..? Thermistor LDR Water level Force sensor Hint 91). Which of the following is the op-amps non-linear application..? Precision rectifier Comparator VI converter Instrumentation amplifier Hint 92). The noise occurred in operational amplifiers because of discrete current flow within the device is ….? Burst Flicker Thermal Shot Hint 93). In bipolar operational amplifier, the stages involved….? 1 2 3 4 Hint 94). In digital integrated circuits, the power dissipation is expressed through….? Nanowatts DB Watts/Kilo Watts MdB Hint 95). The IC package used for experimental purpose is….? Flat pack DIP Meta Transistor pack Hint 96). Metal oxide semiconductor is being used in….? SSI MSI VLSI ULSI Hint 97). What is the use of notch & dot within DIP integrated circuits….? Discover the pin number Determine the Pinout IC property Type of device Hint 98). In IC components, why MOSFET is preferred over BJT? It has less packing density It has medium packing density It response easily Easily fitted Hint 99). In hybrid microwave ICs, the mask is made with…? Si Quartz Rubylith Arsenic Hint 100). Analog Integrated Circuits are available in…..types? 2 4 6 8 Hint Please refer to this link to know more about Integrated Circuit Time is Up! Time's up
