Integrated Circuits Question & AnswersOctober 4, 2021 By WatElectronics This article lists 100+ Integrated Circuits MCQs for engineering students. All the Integrated Circuits Questions & Answers given below include a hint and a link wherever possible to the relevant topic. This is helpful for users who are preparing for their exams, interviews, or professionals who would like to brush up on their fundamentals on IC technology.An integrated circuit (IC) is a small chip made with a semiconductor material like Si. As compared to the normal electronic circuits, which are built with various electronic components, the monolithic IC is the most commonly used chip. Integrated circuits are used in radar, watches, TVs, computers, memory devices, etc 1). An IC contains--------------.?Passive elementsActive elementsBoth Passive and active elementsNone of the aboveHintIC includes both the components 2). The most complicated component fabricated on IC is -------?DiodeResistorTransistorConductor.HintIt is used to amplify the signals 3). The bottom layer of an IC serves as?Connector layerInsulating layerSubstrateNone of the aboveHintThe chemical species within chemical reaction 4). All the active and passive elements are grown on the------layer of the IC?First substrate layerThe second layer which is a single crystal extension of the substrateThe SiO2 layerThe Polysilicon layerHintA single crystal extension of the substrate 5). The substrate is typically of size-----?25 mils thick16 mils thick2 mils thick6 mils thick.Hint>3<7 mils thick. 6). The second layer of IC is of ---------- mils thickness?2311.5HintIt is unity 7). The diffusion of impurities is done on the-----layer?Substrate layerSecond layerSiO2 layerAll of the aboveHintSecondary Layer 8). IC fabrication depends upon---?MaterialsProcessesDesign PrinciplesAll of the aboveHintIt depends on different properties 9).------ protects the wafer from contamination due to impurities?SiO2 layerMasksPhotoresist layerDiffusionHintIt is also known as silica 10). Selective etching is done using------?Diffusion processPhotolithography processMetallization processMasking processHintIt is also known as optical lithography 11). Usually, the substrate of IC is made up of------Germanium metalSiliconSiO2Aluminium.HintThe substrate is made up of p-type silicon melt with a predetermined number of impurities. 12). The cross-section of an IC is usually----?50 by 50 mils6 by 6 mils25 by 25 mils16 by 16 milsHintIt is 50/50 mils 13). The process of forming an IC on a single silicon chip is known as-----Single process ICMonolithic ICEpitaxial ICAll of the aboveHintIt is a group of circuits 14). In epitaxial growth, the resistivity of the n-type epitaxial layer is ------?Independent of the substrateDependent on the substrateEqual to that of the substrateZeroHintThis phenomenon takes on a life of its own 15). A thin layer of SiO2 is formed over the epitaxial layer by exposing the wafer to an oxygen atmosphere at a temperature of ---?1500 Degrees C2500 Degrees C5000 Degrees C1000 Degrees CHintThe termperature is 1K degrees centigrade 16). Silicon dioxide helps the penetration of impurities.TrueFalsePartiallyAll of the above.HintSilicon dioxide layer prevents the penetration of impurities hence helping in selective diffusion after etching. 17). After epitaxial growth the next step for IC fabrication is..?Base diffusionEmitter diffusionMetallizationIsolation diffusionHintIn isolation diffusion, p-type impurities penetrate the n-type epitaxial layer and reaches p-type substrate forming electrical isolation between circuit components (Isolation regions). 18). The collectors of different transistors are drawn from---?Different isolation regionsSame isolation regionsEpitaxial regionPhotoresist regionHintUsing different isolation regions 19). To make p-n junctions reverse biased, with respect to isolation region the p-type substrate must also be held at---?ZeroUnityPositive potentialNegative potentialHintNegative terminal 20). While operating circuit, the isolation will be lost if the p-n junction is-----Reverse biasedForward biasedShort-circuitedOpen circuitedHintIt happens once the voltage across a diode allows the natural current flow 21), To prevent the connection between two isolation islands, the concentration of acceptor ions between isolation regions should be... ?ZeroLower than that of the substrateHigher than that of the substrateEqual to that of the substrate.HintAs compared to substrate it is higher 22). Using base diffusion step------ are formed on IC?Transistor base regionsResistorsAnodes of the diodeAll of the aboveHintResistors, anodes of the diode, etc are formed 23). In base diffusion step ---------impurities are diffused?p-typen-typeBoth p & n-typeNone of the above.HintIn this type, majority charge carriers are holes 24). The resistivity of the base layer is------- the isolation region?Equal toLower thanHigher thanReciprocalHintIt is maximum as compared to isolation region 25). In emitter diffusion step-------- are formed?Transistor emittersResistorsJunction capacitorsOnly a & cHintIn emitter diffusion step n-type diffusion takes place.Integrated Circuits MCQs for Interviews 26). Aluminium is a------------ type impurity in a siliconN-typeP-typeInertMetallicHintThe majority charge carriers in this are holes 27). ------------ prevents the formation of the p-n junction when aluminium is used for ohmic contact?A large concentration of phosphorusA large concentration of SiliconA large concentration of PolysiliconNone of theseHintLarge concentration of n-type phosphorus is diffusion at the areas of ohmic contact during the emitter diffusion process. 28). The interconnections are made during -------Emitter diffusion processPhotolithography processEpitaxial growthMetallization processHintThroughout metalization method 29). For interconnection, Aluminum is deposited on the wafer through------?DiffusionOxidationVacuum depositionAll of these.HintUsing vacuum deposition a thin coating of aluminium is done over the entire surface of the wafer. 30). The-----------technique is used to etch away all the undesired aluminium areas?PhotoresistOxidationDiffusionPolishingHintIt is simply known as a resist 31). The wafer is separated into individual chips after the-----------process?Etching processIsolation processMetallization processDiffusion processHintA large number of identical circuits are simultaneously manufactured on a wafer. So after interconnection, these circuits are separated using a diamond-tipped tool. 32). After attaching the chip to a suitable header, the package leads are connected to IC using -------?Aluminium wire.Copper wireLead wireAll of these.HintWith the help of an Al wire 33). During the photolithographic process the wafer is coated with----?SiO2PolysiliconPhotosensitive emulsionMaskHintIt is a photographic emulsion 34). After placing the mask over the photoresist the wafer is subjected to---?UV raysVisible lightInfrared raysAll of these.HintThese are ultraviolet rays 35). The unexposed portions of the photoresist layer are removed using------?EthyleneWaterCO2TrichloroethyleneHintThe chemical element is TCE 36). The integrated circuit is available in ------ size?LargeSmallMediumNanoHintICs are available in small size. 37). Which of the following material is used to made IC?GermaniumSiliconBoron NitrideCopperHintIt is an IV group element which is also called as Si 38). Which of the following IC package is most popular?TO-5DIPFlat PackThrough HoleHintIt is the standardized US military PCB based surface-mount-component package 39). The most commonly used ICs are?HybridMonolithicThickfilmThinfilmHintIt is a complete circuit, manufactured in a single crystal 40). Which of the following components are not fabricated on IC?TransistorsResistorsDiodesTransformersHintIt is used to step up/down the voltage in electrical circuits. Please refer to this link for Electrical & Electronic Components 41). An active components used in an IC are?DiodesResistorsCapacitorsDiodesHintIt acts like a one way switch 42). ICs used in computers are?AnalogDigitalLinearNone of the aboveHintThese ICs handles discrete signals 43). Which ICs are used in computers?AnalogDigitalLinearNone of the aboveHintThese ICs handles discrete signals 44). Which of the following passive component is more difficult to fabricate on integrated circuit?FETDiodeCapacitorTransistorHintIt is used to store the energy. 45). Which of the following IC is used for special purpose?LM380LM741LM351LM714HintThis IC is used in the audio power application only. 46). In a typical IC package, how many op-amps are used?2468Hint4 quad op-amps, single-2 and dual-2 op-amps 47). Which of the following circuits are not made with digital ICs?MultiplexersDemultiplexersCountersShift RegistersHintThe short form of these circuits is MUX 48). The full form of the SSI is?Small scale industriesSmall scale integrationSurface scale integrationSmall surface integrationHintThe services are finished on a micro/small scale 49). When the components size is increased within the IC, then the IC size will be…?DecreasedIncreasedNo changeIC will damageHintThe size of integrated circuit will be increased. 50). Microelectronics are used to reduce the size of components upto….?3 times2 times10 times5 timesHintThe size will be reduced maximum. Integrated Circuits MCQs for Exams 51). Which of the following IC is an example of linear IC.?Audio amplifierDifferential amplifierInstrumentation amplifierOperational amplifierHintIt is used in audio based applications 52). Which of the following layer works like an insulating layer?SiO2TiO2Graphene OxideMetal OxideHintIt is also recognized in the form of quartz 53). Integrated circuits are used in?Linear & Digital devicesLinear devicesDigital devicesNoneHintThese devices are resistors, capacitors, computers, mobiles, etc 54). Which of the following ICs are used by op-amps?LinearDigitalLinear & DigitalNoneHintIn analog and digital integrated circuits. 55). Which of the following IC is different to 741C version?741S7412C741SC721ASHintThis IC includes SC series 56). The 1st generation integrated circuit includes…?Latch up issueIncludes number of transistorsProtection of short circuitSensitive to temperatureHintFirst generation IC is made with some protection from s/c 57). Transient response is also known as?Steady stateTime varyingLinearNon LinearHintIt changes with time 58). The main drawback of integrated circuit is?It uses more powerParameter within the IC cannot be changedIt uses less external connectionsLarge sizeHintIC parameters are fixed 59). The op-amps internal circuit is?ClipperClamperDifferential AmplifierDiodeHintThese are also known DC voltage restorers. 60). The tool used to observe the connection between an integrated circuit?MicrophoneTelescopeMicroscopeLensesHintIt generates enlarged images of tiny objects 61).Which of the below components are available in monolithic IC?Active & Passive componentsLinear componentsNon-linear componentsNone of the aboveHintThese components use some property for controlling the electrical signal. 62).The performance of monolithic IC is?Depends on the connectionsOn PackagingOn SubstrateDoesn’t depend on the substrateHintIt depends on rock, fungi, etc 63).Oxidation is mainly used for?DopingIsolationInterconnectionRemove connectionsHintIt is used to prevent DC and AC in a system 64). Metallization is mainly used for?PackagingInterconnectionProtectionSecurityHintIt is a mutual connection between two parts 65).Packaging in IC is used for?InterconnectionSafetyProvide supplyCleaningHintIt is used for protection purpose 66).What is the function of testing?For quality controlTo check the functionality of componentsTo provide supplyCheck the errorsHintIt is used to check the quality of product whether that is improved or not. 67).What is the purpose of optical masking?For safetyFor cleaningFor pattern transferNoneHintUsed for transferring pattern 68).Etching is used to …?Remove surfaceGive protectionProtect from short circuitProvide packageHintThe shell of an IC can be removed 69). The system on chip or SoC includes… ?Analog ICsLinear ICsAnalog & Digital ICsNon-linear ICsHintIn includes both the integrated circuits 70). In which of the following circuits components are soldered… ?LinearDiscreteAnalogMonolithicHintThese components are connected on PCB through connecting wires 71). The logic gates used in large scale ICs are…?< 12>12<100>100<1000>1000HintHighest number of logic gates are used 72). It is not achievable to generate integrated circuits of power rating above …?1 Watt5 Watts10 Watts1000 WattsHintBelow 100 watts 73). In which of the following layer monolithic IC is fabricated…?SiGeTaCuHintThe atomic number of this element is 73 74). The interconnection of IC components can be done through an aluminum conductor is known as?Sputtering processMetalization processSwitching processEtching processHintThis kind of process generates thin-film metal layer 75). Which of the below circuits are also known as digital circuits?Timer CircuitsSwitching CircuitsCodersTimersHintSwitching circuits performs arithmetic/ logic operations. 76). In which of the following ICs fabrication, monolithic method is used?AnalogDigitalLinearNon-linearHintThese are also known as combinational logic ICs 77). Which of the below components are used like an individual components in thick film and thin film ICs from outside?TransistorResistorDiodeCapacitorHintTransistor is used to switch or amplify electronic signals 78). The chip is also called as?DeviceSubstrateInterposeDieHintIt is a semiconducting material block 79).The size of any normal integrated circuit is?0.2mm X 0.2mm X 0.001mm0.1mm X 0.2mm X 0.01mm0.01mm X 0.1mm X 0.2mm0.2mm X 0.001mm X 0. 1mmHintIts length and widths are 0.2mm X 0.2mm 80).The SSI chip includes….components?<12>20<5>100HintIt ranges from >10 to <15 81). As compared to an inductor, transistor occupies…space?MoreLessSimilarCannot be fittedHintThe space occupied by an inductor is more 82).The analog inputs and channel multiplexers present in an ADC 0809 IC are?281012HintIt ranges from >5 and <10 83). How the quantization error can be reduced in an ADC?By enhancing the bitsReducing the bitsMaintaining the bits stableNone of the aboveHintBy increasing the bits 84).For an ideal operational amplifier, the PSRR value is?10Infinite-1HintThe PSRR values is null 85).Which of the following is an op-amp parameter ?PSSRPSWRPSVRPSVSHintIt is used to reject ripple at the input 86). Differential amplifier’s CMRR can be enhanced through decreasing…?Common mode voltage gainTemperatureDifferential voltage gainS/N ratioHintWhen both inputs of this amplifier is same then it is low 87).The series pass transistor in a linear voltage regulator operates in…….?Saturation regionActive regionCut-offNoneHintThis region lies in between cut off & saturation 88). In DAC, when the number of bits increases then the resolution will be….?DecreasedIncreasedConstantNone of the aboveHintIt is directly proportional 89). What is the response time value of an ideal comparator….?10Infinite-1HintThe value is null 90). Which of the following sensor is used in a temperature controller circuit with an instrumentation amplifier..?ThermistorLDRWater levelForce sensorHintIt is a resistance thermometer 91). Which of the following is the op-amps non-linear application..?Precision rectifierComparatorVI converterInstrumentation amplifierHintIt is one kind of rectifier 92). The noise occurred in operational amplifiers because of discrete current flow within the device is ….?BurstFlickerThermalShotHintIt is also called poisson noise 93). In bipolar operational amplifier, the stages involved….?1234HintThe stages are triple 94). In digital integrated circuits, the power dissipation is expressed through….?NanowattsDBWatts/Kilo WattsMdBHintThe power dissipation in DIC is expressed in milli or nano watts 95). The IC package used for experimental purpose is….?Flat packDIPMetaTransistor packHintThis package is easy to mount 96). Metal oxide semiconductor is being used in….?SSIMSIVLSIULSIHintIt is also known as very large scale integration technology 97). What is the use of notch & dot within DIP integrated circuits….?Discover the pin numberDetermine the PinoutIC propertyType of deviceHintUsed to represent the pin number in IC 98). In IC components, why MOSFET is preferred over BJT?It has less packing densityIt has medium packing densityIt response easilyEasily fittedHintThe number of MOSFET cells is fitted in a specific area 99). In hybrid microwave ICs, the mask is made with…?SiQuartzRubylithArsenicHintIt is used in several areas of graphic design. 100). Analog Integrated Circuits are available in…..types?2468HintThey are linear ICs & RF ICs Please refer to this link to know more about Integrated Circuit Time is Up! Time's up
