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Integrated Circuits Question & Answers

October 4, 2021 By WatElectronics

This article lists 100+ Integrated Circuits MCQs for engineering students. All the Integrated Circuits Questions & Answers given below include a hint and a link wherever possible to the relevant topic. This is helpful for users who are preparing for their exams, interviews, or professionals who would like to brush up on their fundamentals on IC technology.

An integrated circuit (IC) is a small chip made with a semiconductor material like Si. As compared to the normal electronic circuits, which are built with various electronic components, the monolithic IC is the most commonly used chip.

The different types of integrated circuits available in the market are; analog, digital, linear, RF, mixed,  logic circuits, comparators, voltage regulators, op-amps, timer ICs, etc. The advantages of ICs mainly include; less cost, small size, reliability, less weight, etc.

The disadvantages of ICs are; In an integrated circuit, different components are fabricated but if any component fails in IC, then the whole integrated circuit has to be changed with a new one. The dissipation of power is restricted to 10 watts.

The applications of Integrated circuits mainly include; radar, watches, TVs, computers, memory devices, Wristwatches, Juice makers, TVs, logic devices,  memory devices, Video processors, etc.

 

1). An IC contains--------------.?
HintIC includes both the components
2). The most complicated component fabricated on IC is -------?
HintIt is used to amplify the signals
3). The bottom layer of an IC serves as?
HintThe chemical species within chemical reaction
4). All the active and passive elements are grown on the------layer of the IC?
HintA single crystal extension of the substrate
5). The substrate is typically of size-----?
Hint>3<7 mils thick.
6). The second layer of IC is of ---------- mils thickness?
HintIt is unity
7). The diffusion of impurities is done on the-----layer?
HintSecondary Layer
8). IC fabrication depends upon---?
HintIt depends on different properties
9).------ protects the wafer from contamination due to impurities?
HintIt is also known as silica
10). Selective etching is done using------?
HintIt is also known as optical lithography
11). Usually, the substrate of IC is made up of------
HintThe substrate is made up of p-type silicon melt with a predetermined number of impurities.
12). The cross-section of an IC is usually----?
HintIt is 50/50 mils
13). The process of forming an IC on a single silicon chip is known as-----
HintIt is a group of circuits
14). In epitaxial growth, the resistivity of the n-type epitaxial layer is ------?
HintThis phenomenon takes on a life of its own
15). A thin layer of SiO2 is formed over the epitaxial layer by exposing the wafer to an oxygen atmosphere at a temperature of ---?
HintThe termperature is 1K degrees centigrade
16). Silicon dioxide helps the penetration of impurities.
HintSilicon dioxide layer prevents the penetration of impurities hence helping in selective diffusion after etching.
17). After epitaxial growth the next step for IC fabrication is..?
HintIn isolation diffusion, p-type impurities penetrate the n-type epitaxial layer and reaches p-type substrate forming electrical isolation between circuit components (Isolation regions).
18). The collectors of different transistors are drawn from---?
HintUsing different isolation regions
19). To make p-n junctions reverse biased, with respect to isolation region the p-type substrate must also be held at---?
HintNegative terminal
20). While operating circuit, the isolation will be lost if the p-n junction is-----
HintIt happens once the voltage across a diode allows the natural current flow
21), To prevent the connection between two isolation islands, the concentration of acceptor ions between isolation regions should be... ?
HintAs compared to substrate it is higher
22). Using base diffusion step------ are formed on IC?
HintResistors, anodes of the diode, etc are formed
23). In base diffusion step ---------impurities are diffused?
HintIn this type, majority charge carriers are holes
24). The resistivity of the base layer is------- the isolation region?
HintIt is maximum as compared to isolation region
25). In emitter diffusion step-------- are formed?
HintIn emitter diffusion step n-type diffusion takes place.

Integrated Circuits  MCQs for Interviews

26). Aluminium is a------------ type impurity in a silicon
HintThe majority charge carriers in this are holes
27). ------------ prevents the formation of the p-n junction when aluminium is used for ohmic contact?
HintLarge concentration of n-type phosphorus is diffusion at the areas of ohmic contact during the emitter diffusion process.
28). The interconnections are made during -------
HintThroughout metalization method
29). For interconnection, Aluminum is deposited on the wafer through------?
HintUsing vacuum deposition a thin coating of aluminium is done over the entire surface of the wafer.
30). The-----------technique is used to etch away all the undesired aluminium areas?
HintIt is simply known as a resist
31). The wafer is separated into individual chips after the-----------process?
HintA large number of identical circuits are simultaneously manufactured on a wafer. So after interconnection, these circuits are separated using a diamond-tipped tool.
32). After attaching the chip to a suitable header, the package leads are connected to IC using -------?
HintWith the help of an Al wire
33). During the photolithographic process the wafer is coated with----?
HintIt is a photographic emulsion
34). After placing the mask over the photoresist the wafer is subjected to---?
HintThese are ultraviolet rays
35). The unexposed portions of the photoresist layer are removed using------?
HintThe chemical element is TCE
36). The integrated circuit is available in ------ size?
HintICs are available in small size.
37). Which of the following material is used to made IC?
HintIt is an IV group element which is also called as Si
38). Which of the following IC package is most popular?
HintIt is the standardized US military PCB based surface-mount-component package
39). The most commonly used ICs are?
HintIt is a complete circuit, manufactured in a single crystal
40). Which of the following components are not fabricated on IC?
HintIt is used to step up/down the voltage in electrical circuits.
Please refer to this link for Electrical & Electronic Components
41). An active components used in an IC are?
HintIt acts like a one way switch
42). ICs used in computers are?
HintThese ICs handles discrete signals
43). Which ICs are used in computers?
HintThese ICs handles discrete signals
44). Which of the following passive component is more difficult to fabricate on integrated circuit?
HintIt is used to store the energy.
45). Which of the following IC is used for special purpose?
HintThis IC is used in the audio power application only.
46). In a typical IC package, how many op-amps are used?
Hint4 quad op-amps, single-2 and dual-2 op-amps
47). Which of the following circuits are not made with digital ICs?
HintThe short form of these circuits is MUX
48). The full form of the SSI is?
HintThe services are finished on a micro/small scale
49). When the components size is increased within the IC, then the IC size will be…?
HintThe size of integrated circuit will be increased.
50). Microelectronics are used to reduce the size of components upto….?
HintThe size will be reduced maximum.

Integrated Circuits MCQs for Exams

51). Which of the following IC is an example of linear IC.?
HintIt is used in audio based applications
52). Which of the following layer works like an insulating layer?
HintIt is also recognized in the form of quartz
53). Integrated circuits are used in?
HintThese devices are resistors, capacitors, computers, mobiles, etc
54). Which of the following ICs are used by op-amps?
HintIn analog and digital integrated circuits.
55). Which of the following IC is different to 741C version?
HintThis IC includes SC series
56). The 1st generation integrated circuit includes…?
HintFirst generation IC is made with some protection from s/c
57). Transient response is also known as?
HintIt changes with time
58). The main drawback of integrated circuit is?
HintIC parameters are fixed
59). The op-amps internal circuit is?
HintThese are also known DC voltage restorers.
60). The tool used to observe the connection between an integrated circuit?
HintIt generates enlarged images of tiny objects
61).Which of the below components are available in monolithic IC?
HintThese components use some property for controlling the electrical signal.
62).The performance of monolithic IC is?
HintIt depends on rock, fungi, etc
63).Oxidation is mainly used for?
HintIt is used to prevent DC and AC in a system
64). Metallization is mainly used for?
HintIt is a mutual connection between two parts
65).Packaging in IC is used for?
HintIt is used for protection purpose
66).What is the function of testing?
HintIt is used to check the quality of product whether that is improved or not.
67).What is the purpose of optical masking?
HintUsed for transferring pattern
68).Etching is used to …?
HintThe shell of an IC can be removed
69). The system on chip or SoC includes… ?
HintIn includes both the integrated circuits
70). In which of the following circuits components are soldered… ?
HintThese components are connected on PCB through connecting wires
71). The logic gates used in large scale ICs are…?
HintHighest number of logic gates are used
72). It is not achievable to generate integrated circuits of power rating above …?
HintBelow 100 watts
73). In which of the following layer monolithic IC is fabricated…?
HintThe atomic number of this element is 73
74). The interconnection of IC components can be done through an aluminum conductor is known as?
HintThis kind of process generates thin-film metal layer
75). Which of the below circuits are also known as digital circuits?
HintSwitching circuits performs arithmetic/ logic operations.
76). In which of the following ICs fabrication, monolithic method is used?
HintThese are also known as combinational logic ICs
77). Which of the below components are used like an individual components in thick film and thin film ICs from outside?
HintTransistor is used to switch or amplify electronic signals
78). The chip is also called as?
HintIt is a semiconducting material block
79).The size of any normal integrated circuit is?
HintIts length and widths are 0.2mm X 0.2mm
80).The SSI chip includes….components?
HintIt ranges from >10 to <15
81). As compared to an inductor, transistor occupies…space?
HintThe space occupied by an inductor is more
82).The analog inputs and channel multiplexers present in an ADC 0809 IC are?
HintIt ranges from >5 and <10
83). How the quantization error can be reduced in an ADC?
HintBy increasing the bits
84).For an ideal operational amplifier, the PSRR value is?
HintThe PSRR values is null
85).Which of the following is an op-amp parameter ?
HintIt is used to reject ripple at the input
86). Differential amplifier’s CMRR can be enhanced through decreasing…?
HintWhen both inputs of this amplifier is same then it is low
87).The series pass transistor in a linear voltage regulator operates in…….?
HintThis region lies in between cut off & saturation
88). In DAC, when the number of bits increases then the resolution will be….?
HintIt is directly proportional
89). What is the response time value of an ideal comparator….?
HintThe value is null
90). Which of the following sensor is used in a temperature controller circuit with an instrumentation amplifier..?
HintIt is a resistance thermometer
91). Which of the following is the op-amps non-linear application..?
HintIt is one kind of rectifier
92). The noise occurred in operational amplifiers because of discrete current flow within the device is ….?
HintIt is also called poisson noise
93). In bipolar operational amplifier, the stages involved….?
HintThe stages are triple
94). In digital integrated circuits, the power dissipation is expressed through….?
HintThe power dissipation in DIC is expressed in milli or nano watts
95). The IC package used for experimental purpose is….?
HintThis package is easy to mount
96). Metal oxide semiconductor is being used in….?
HintIt is also known as very large scale integration technology
97). What is the use of notch & dot within DIP integrated circuits….?
HintUsed to represent the pin number in IC
98). In IC components, why MOSFET is preferred over BJT?
HintThe number of MOSFET cells is fitted in a specific area
99). In hybrid microwave ICs, the mask is made with…?
HintIt is used in several areas of graphic design.
100). Analog Integrated Circuits are available in…..types?
HintThey are linear ICs & RF ICs
Please refer to this link to know more about Integrated Circuit
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